Cleveland Circuits Corporation manufactures exceptional RF metal core PCBs (MCPCB) designed to enhance thermal management and grounding capabilities. We produce single-sided, double-sided, and multilayer circuit boards with metal cladding for applications in high-frequency telecommunications and aerospace industries. Our RF metal core PCBs feature integrated metal heat sinks that facilitate both thermal dissipation and electrical grounding.
Key Features:
- Metal Cladding/MCPCB: Improves thermal management and electrical grounding.
- High Frequency PCBs with Metal Heatsinks: Tailored for telecommunications and aerospace applications.
- Thermally and Electrically Connected: Ensures efficient thermal dissipation and circuit grounding.
- Pre-Bonded and Post-Bonded Materials: Utilizes commercially available pre-bonded laminates from Rogers or Taconic, with post-bonding using sheet film adhesive materials including ASC’s patented adhesives or sweat solder.
- Applications: RF Power Amplifiers, Splitters & Combiners, Complex Filters, and RF Power Distribution.
- Laminate/Dielectric Material Suppliers: Includes Isola, Nelco, Rogers, and Taconic.
- Metal Options: Aluminum, Copper, and Brass Composites.
- Pre-bonded and post-bonded materials
- Thermally and electrically conductive and non-conductive proprietary adhesive bonded laminates
- Plated through-hole capability metal carrier to PTFE
- In-house plating and precision machining for finished assemblies
- Pre-bonded and post-bonded materials
- Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
- Plated through-hole capability metal carrier to PTFE
- Single, Double-sided & Multilayer
- Precision pocket machining
- Heat sink technology
- Any type of wire bondable finishes
- In-house plating and precision machining for finished assemblies
- Pre-bonded to Post-bonded assembly conversion
- Discrete PCB to Pre-bond or Post-bond assembly conversion
American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.