Embedded Passives: Enhancing PCB Performance

Embedded Passives

Embedded passives revolutionize PCB design by integrating resistors and capacitors directly into the substrate, eliminating the need for discrete components. This advanced manufacturing technique enhances miniaturization, reduces weight, and lowers assembly costs while boosting reliability and performance, especially in high-frequency applications.

Embedded Capacitance Materials

Embedded capacitance materials utilize ceramic-filled epoxy layers between copper foils, forming power and ground planes that reduce impedance and enhance shared capacitance power distribution. This innovation optimizes board space by eliminating multiple capacitors below 0.1 μF and their associated solder joints and vias.

Embedded Resistor Materials

Embedded resistors are thin-film planar resistive elements integrated into PCB layers, replacing traditional discrete resistors and solder joints. They enable PCB miniaturization, increase density, improve signal integrity, and enhance electrical performance and reliability. ASC collaborates with leading materials like Quantic Ticer TCR®, Quantic Ticer TCR-EHF®, Quantic OhmegaPly®, and Oak-Mitsui FaradFlex® on FR4 and high-performance laminates such as Rogers RO3000, RO4000, and RT/duroid 6000 series, and flex polyimide. Pairing these technologies with HDI features like blind/buried/micro vias, cavities, and coins ensures robust solutions for diverse PCB applications.
  • Space-saving: Integrating passive components directly into the PCB eliminates the need for separate components, saving valuable board space. This is particularly beneficial in miniaturized electronic devices where space is limited.
  • Reduced parasitic effects: Embedding passive components minimizes parasitic effects such as parasitic capacitance and inductance that can occur with discrete components. This results in improved high-frequency performance and signal integrity.
  • Improved reliability: Embedded passive components are less prone to damage from mechanical stress, vibration, and environmental factors compared to discrete components. This enhances the overall reliability and durability of the electronic system.
  • Enhanced electrical performance: Embedded passive components can provide more precise and consistent electrical characteristics compared to discrete components, leading to better matching and control of component values across different parts of the circuit.
  • Cost-effectiveness: While there may be initial setup costs associated with embedded passive technology, it can lead to cost savings over the long term due to reduced component count, simplified assembly processes, and potentially lower maintenance and warranty costs.
  • Enhanced thermal management: Embedding passive components within the PCB allows for more efficient thermal dissipation compared to discrete components, leading to better heat distribution and improved thermal management in high-power applications.
  • Design flexibility: Embedded passive technology offers greater design flexibility, allowing for customized component values, geometries, and placement to optimize circuit performance and functionality.
  • Improved manufacturability: Integrating passive components into the PCB simplifies the assembly process, reduces handling steps, and improves manufacturing yield, leading to higher production efficiency and lower manufacturing costs.
  • Consumer electronics
  • MilAero
  • Biomedical
  • Automotive
  • Microwave/RF